| 摘要 |
<p>An adhesive film can ensure reliable continuity even if a filler and a binder composition are not sufficiently removed from between a wiring board and a semiconductor chip during flip-chip mounting of the semiconductor chip on the wiring board using an adhesive film containing a non-conductive filler. The adhesive film is formed from a binder composition including an epoxy compound, a curing agent, and the filler. The amount of the filler contained with respect to a total amount of the epoxy compound, the curing agent, and the filler is 10 to 70 mass%. The filler includes first non-conductive inorganic particles having an average particle size of 0.5 to 1.0 µm, and conductive particles formed by subjecting second non-conductive inorganic particles having an average particle size of 0.5 to 1.0 µm to an electroless plating treatment so that the average particle size of the conductive particles does not exceed 1.5 µm. The conductive particles is contained in an amount of 10 to 60 mass% of the filler.</p> |
