IMPROVED ADHESION TO COPPER AND COPPER ELECTROMIGRATION RESISTANCE

摘要

PURPOSE: A method for improving the adhesion with respect to copper and the copper electro-migration resistance is provided to improve the adhesion between a metal layer and a barrier layer by depositing an adhesive layer between a patterned barrier dielectric layer and a patterned conductive metal layer. CONSTITUTION: One or more patterned dielectric layers are formed on a substrate. One or more patterned conductive metal layers are formed on the patterned dielectric layers. An adhesive layer is formed on the patterned conductive metal layers. The adhesive layer is selected from a group including tin and zinc. An adhesive layer is selectively deposited on the patterned conductive metal layers by introducing an organic metal precursor. A dielectric barrier layer is deposited on the substrate with the adhesive layer.