SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same are provided to reduce the horizontal/vertical size of the semiconductor package by omitting the formation of a dam preventing the flow of an under-fill resin. CONSTITUTION: A first substrate(202) includes a first surface part located in a first region(A) and a second surface part located in a second region(B). The first region is formed in a region between a semiconductor chip(150) and a second connection terminal(105b). The surface roughness of the first surface part is different from that of the second surface part. A first semiconductor chip is mounted on the first substrate. A first protective film fills a region between the first semiconductor chip and the first substrate.