| 摘要 |
The present invention relates to a semiconductor package in which a semiconductor device (16) is provided on a surface of a base portion (10). And, the semiconductor package is characterized in that the base portion is configured by bringing a plurality of thin plates (12, 14) in close contact with each other to bond them integrally, and at least one heat pipe (36) is included in the base portion and is arranged to extend from a heat generation site corresponding position to a position in an outside of the heat generation site corresponding position. |
