Multilayer ceramic substrate, Method of forming conductive vias having multi-electrode and Method of fabricating multilayer ceramic substrate using the same,申请号KR20090001227-传众专利搜索

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发明名称	Multilayer ceramic substrate, Method of forming conductive vias having multi-electrode and Method of fabricating multilayer ceramic substrate using the same
摘要
申请公布号	KR101018100(B1)	申请公布日期	2011.02.25
申请号	KR20090001227	申请日期	2009.01.07
申请人		发明人
分类号	H05K3/40;H05K3/46	主分类号	H05K3/40
代理机构		代理人
主权项
地址

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