| 摘要 |
A method of manufacturing a solid state image pickup device having a plurality of pixels each including a photoelectric conversion region for converting light into a signal charge, and a plurality of wiring layers including first and second wiring layers. The method includes steps of forming the first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing the plurality of patterns, and forming the second wiring layer as a pattern by batch exposure processing. A connecting position along which the divided patterns are connected is arranged in a pixel area in which the plurality of pixels are arranged. The wiring included in the first wiring layer is formed by a vertical direction wiring arranged in parallel with and not crossing the connecting position in the pixel area, and the wiring included in the second wiring layer is formed by a horizontal direction wiring arranged in parallel with and crossing the connecting position in the pixel area.
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