| 摘要 |
<p>A cutting apparatus for separating two plate devices is provided, wherein the two plate devices are connected to each other by an adhesive layer (G1). The cutting apparatus includes a base, a carrier (30) movably disposed on the base to hold the plate devices, a wire (W), and a reel mechanism (20) disposed on the base for moving the wire. The wire (W) cuts through the adhesive layer (G1) while the carrier (30) moves with respect to the base, so that the plate devices are separated from each other.</p> |
