发明名称 EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>PURPOSE: An embedded substrate and the manufacturing method thereof in which the molding progress unnecessaries. CONSTITUTION: An embedded substrate(100) and manufacturing method thereof comprises a device entering to the base substrate and the empty space having inside the base substrate(110). The insulating layer in which the empty space in which device is inserted is filled and fixing device on the base inside substrate is made.</p>
申请公布号 KR20110018685(A) 申请公布日期 2011.02.24
申请号 KR20090076273 申请日期 2009.08.18
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KIM, DAE GON;LEE, SOO BONG
分类号 H05K1/18;H05K1/02 主分类号 H05K1/18
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