发明名称 |
EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>PURPOSE: An embedded substrate and the manufacturing method thereof in which the molding progress unnecessaries. CONSTITUTION: An embedded substrate(100) and manufacturing method thereof comprises a device entering to the base substrate and the empty space having inside the base substrate(110). The insulating layer in which the empty space in which device is inserted is filled and fixing device on the base inside substrate is made.</p> |
申请公布号 |
KR20110018685(A) |
申请公布日期 |
2011.02.24 |
申请号 |
KR20090076273 |
申请日期 |
2009.08.18 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
KIM, DAE GON;LEE, SOO BONG |
分类号 |
H05K1/18;H05K1/02 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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