| 摘要 |
PURPOSE: A chip and a chip-substrate complex assembly are provided to prevent solder from permeating a layer group by including at least one interface on a soldering layer. CONSTITUTION: A layer group is formed on one side of a chip body made of semiconductor materials. The layer group is vertically positioned and is comprised of a plurality of metal layers. A plurality of metal layers are generated by a physical coating method. A soldering layer(5) is formed between a chip body and a noble metal positioned on the surface of the layer group. A soldering layer has at least one interface(G1,G2) formed by stopping the coating method. |
