| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a setting operation method of ultrasonic wave bonding capable of accurately aligning a bonding head element with an ultrasonic wave device as a reference element and an ultrasonic wave bonder. <P>SOLUTION: The method is a method of aligning the bonding head element which a bonding head 1 of the ultrasonic wave bonder comprises with a reference element. At least an area around a tip end part of the ultrasonic wave device 3, which is the reference element, is captured optically by a camera 8 and a marking is displayed in a superposing manner on an image on a display device to assist alignment. Further, the ultrasonic wave bonder is the ultrasonic wave bonder in which, to assist alignment of the bonding head element, the camera 8 optically captures at least the tip end part of the ultrasonic wave device 3, which is the reference element, and displays it. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
