| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inspection apparatus capable of measuring precisely a focusing state of an exposure device in a short time. <P>SOLUTION: A surface inspection apparatus 1 includes a stage 5 for supporting a wafer 10 exposed by the exposure device 50 and formed with a semiconductor pattern on a surface, an illumination system 20 for irradiating the surface of the wafer 10 supported by the stage 5 with an illumination light, an imaging device 35 for detecting a light from the surface of the wafer 10 irradiated with the illumination light, and an image processing portion 40 for finding a fluctuation state in focusing of the exposure device 50 with respect to the surface of the wafer 10, based on information of the light from the surface of the wafer 10 detected by the imaging device 35. <P>COPYRIGHT: (C)2011,JPO&INPIT |
