| 摘要 |
PROBLEM TO BE SOLVED: To provide a dielectric thin film element capable of relaxing mechanical stress applied when mounting it. SOLUTION: There is disclosed a dielectric thin film element 10 that includes: a substrate 11; an adhesive layer 13 formed on one main surface of the substrate 11; a capacitance part 20 formed on the adhesive layer 13 comprising a dielectric layer 22 and having at least one pair of electrode layers 21 and 23 that are formed on the upper surface and lower surface of the dielectric layer; extraction electrodes 41 and 42 that are electrically connected to the lower electrode layer 21 and the upper electrode layer 23; external electrodes 43 and 44 that are partially formed in a plural fashion on the extraction electrodes 41 and 42; and an organic insulating layer 33 locating between the external electrodes 43 and 44. COPYRIGHT: (C)2011,JPO&INPIT
|
