| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem wherein voids may be produced, because of carried out underfill resulting from application of an underfill in divided several times for example, in a gap under an IC chip when an area, to which the underfill resin is to be applied, is small because the underfill resin needs to be applied in several small batches so as to prevent the underfill resin from spreading out to an area not requiring application. SOLUTION: When applying the underfill resin 8 in several small batches, an Nth (N≥2) underfill resin application process is performed before a fillet 11, which is formed with small batches of the underfill resin 8 that have been applied before and in the N-1th application process, is minimized. Preferably, in the Nth underfill resin application process, a small batch of the underfill resin 8 is applied on the batches of the underfill resin 8 that have been applied before and in the N-1th application process. COPYRIGHT: (C)2011,JPO&INPIT |
