发明名称 |
PREPARING SUBSTRATES CONTAINING POLYMERS FOR METALLIZATION |
摘要 |
PURPOSE: A method for manufacturing polymer contained substrate for metallization is provided to swell or soften polymer in a wide Tg range without the deterioration of the fine roughening performance and the polymer elimination performance. CONSTITUTION: One or more polymers and a plurality of vias are contained in a substrate. One or more amphiprotic surfactants, one or more organic solvents, and one or more dispersing agents are applied on the substrate and are swelled. An oxidizer is applied on the swelled polymers, and one or more polymers are desmeared from the vias or are topographically changed. The amphiprotic surfactants are selected from n-alkyl amino propionate or n-alkyl amino dipropionate. |
申请公布号 |
KR20110018849(A) |
申请公布日期 |
2011.02.24 |
申请号 |
KR20100079627 |
申请日期 |
2010.08.18 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. |
发明人 |
LI CRYSTAL P. L.;YEE DENNIS K. W.;TANG MICHAEL CY |
分类号 |
H05K3/40;C23C18/22;H05K3/26 |
主分类号 |
H05K3/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|