发明名称 COMPOSITION FOR ELECTROCHEMICAL DEVICE ELECTRODE BINDER, COMPOSITION FOR ELECTROCHEMICAL DEVICE ELECTRODE, ELECTROCHEMICAL DEVICE ELECTRODE, AND ELECTROCHEMICAL DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a composition for an electrochemical device electrode binder which has high adhesion strength between a collector and an electrode layer and hardly peels off the electrode layer from the collector and is suitable for press aptitude and forms an electrochemical device electrode with high flexibility. <P>SOLUTION: The composition for an electrochemical device electrode binder includes a binding resin (A), and a compound (B) expressed by general formula (1) (R<SP>1</SP>: 5-30C monovalent hydrocarbon group, R<SP>2</SP>and R<SP>3</SP>: hydrogen atom) or general formula (2) (R<SP>4</SP>and R<SP>8</SP>: 5-30C monovalent hydrocarbon group, R<SP>5</SP>and R<SP>7</SP>: hydrogen atom, R<SP>6</SP>: 2-4C bivalent hydrocarbon group). <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011040309(A) 申请公布日期 2011.02.24
申请号 JP20090187666 申请日期 2009.08.13
申请人 JSR CORP 发明人 MOGI TAKESHI;MASAKA FUSAZUMI;HONDA TATSURO;TEZUKA TERUAKI
分类号 H01M4/62;H01G11/06;H01G11/22;H01G11/38;H01G11/54;H01G11/58;H01G11/60;H01G11/84;H01G11/86;H01M4/13;H01M4/139 主分类号 H01M4/62
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