| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate structure used for LEDs or power elements, and to provide a method of manufacturing the same. <P>SOLUTION: With the substrate structure, a buffer layer is formed on a projected area of a substrate, a semiconductor layer is formed the upper part thereof, and an area excluding the projected area of the substrate and the buffer layer are isolated. Thereby, the semiconductor layer, on the buffer layer which is not in contact with the substrate, has a free standing property, allowing generation of dislocations and cracks to be avoided. <P>COPYRIGHT: (C)2011,JPO&INPIT |
