| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress the number of pins for bonding wire connection used for switching functions. <P>SOLUTION: A plurality of pads are arranged on a semiconductor chip 2 of a semiconductor device 100. A first pad PAD1 is arranged on a path of a first signal S1, which has a voltage corresponding to a first level in an operation state of the semiconductor device 100 and is input from an external of the semiconductor device 100 to the semiconductor chip 2 and is output from the semiconductor chip 2 to the external of the semiconductor device 100. A second pad is arranged for receiving a set voltage Vset. The first pin PNI1 is connected to the first pad PAD1 through a connection means W1, and receives the first signal S1 from the external of the semiconductor device 100, or from the semiconductor chip 2 through the first pad PAD1. The second pin PIN2 receives a second signal S2 having a voltage corresponding to the first level or second level complementary to it from the external. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
