| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for packaging an electronic device that mechanically isolates the electronic device from its supporting substrate, eliminating transmission of mechanical stress from the substrate to the device. SOLUTION: The apparatus includes a plurality of elongated members that extend from a frame 14 support 18 to a center opening, where the ends of the elongated members together support the electronic device. The shape, material and orientation of the elongated members combine to both support the electronic device 12 and absorb mechanical force transmitted from the substrate to the support frame. In one embodiment, the absorbing portion is substantially perpendicular to the direction of the transmitted force and the transmitted force is absorbed by mechanical displacement of one end of the perpendicular portion. The apparatus and method eliminate the negative effects of thermal stress mismatch between the electronic device and its supporting substrate. COPYRIGHT: (C)2011,JPO&INPIT
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