| 摘要 |
An electronic apparatus including a common substrate, a plurality of controlled electronic devices disposed over the common substrate, and a wiring layer having a plurality of conductors formed on the common substrate. A plurality of chiplets are located over the common substrate, each chiplet having an independent substrate separate from the common substrate, each independent substrate having a bottom side opposing a top side with one or more connection pads formed on the bottom side of the chiplet, and each chiplet including circuitry for controlling functions of one or more of the controlled electronic devices. The chiplets are adhered to the common substrate with the bottom side of the chiplet closer to the common substrate than the top side of the chiplet, and each connection pad is electrically connected to one of the plurality of conductors.
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