发明名称 Elektronisches Bauteil mit Kontaktelementen
摘要 <p>The component (10) has contact units (12) that contact the component with a printed circuit board (22), where the contact units have a set of bendings in sections. The contact units are foldable in sections in such a manner that the contact units are unfolded from the folded condition in a main unfolded direction. The component is spaced apart from an assembling surface of the printed circuit board. The unfolded direction extends perpendicular to the assembling surface of the printed circuit board. An independent claim is also included for a method for contacting an electronic component with a printed circuit board.</p>
申请公布号 DE502006008706(D1) 申请公布日期 2011.02.24
申请号 DE20065008706T 申请日期 2006.05.23
申请人 DELPHI TECHNOLOGIES INC. 发明人 HOMBACH, FRANK;HUPERTZ, STEFAN;NOLL, DIETHELM
分类号 H01R13/24;H01L33/00;H05K3/34 主分类号 H01R13/24
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