发明名称 |
Elektronisches Bauteil mit Kontaktelementen |
摘要 |
<p>The component (10) has contact units (12) that contact the component with a printed circuit board (22), where the contact units have a set of bendings in sections. The contact units are foldable in sections in such a manner that the contact units are unfolded from the folded condition in a main unfolded direction. The component is spaced apart from an assembling surface of the printed circuit board. The unfolded direction extends perpendicular to the assembling surface of the printed circuit board. An independent claim is also included for a method for contacting an electronic component with a printed circuit board.</p> |
申请公布号 |
DE502006008706(D1) |
申请公布日期 |
2011.02.24 |
申请号 |
DE20065008706T |
申请日期 |
2006.05.23 |
申请人 |
DELPHI TECHNOLOGIES INC. |
发明人 |
HOMBACH, FRANK;HUPERTZ, STEFAN;NOLL, DIETHELM |
分类号 |
H01R13/24;H01L33/00;H05K3/34 |
主分类号 |
H01R13/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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