APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing a semiconductor, suppressing the contamination of a wafer and achieving high performance and reliability improvement of a semiconductor device.

SOLUTION: The apparatus for manufacturing the semiconductor includes: a reactor furnace into which the wafer is introduced; a gas supply mechanism for supplying process gas to the reactor furnace; a gas ejection mechanism for ejecting gas from the reactor furnace; a wafer support member for placing the wafer; a heater having a heater element for heating the wafer to a predetermined temperature and a heater electrode part molded integrally with the heater element; an electrode component connected to the heater electrode part to apply voltage to the heater electrode part; a base for fixing the electrode component; and a rotational driving control mechanism for rotating the wafer. At least a portion of a connection part between the heater electrode part and the electrode component is disposed below the upper face of the base.

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