发明名称 |
FILM FORMING, SILICONE CONTAINING COMPOSITIONS |
摘要 |
The invention relates to silicone containing compositions able to form adhesive films on substrates, which typically comprises a curable silicone composition comprising components (a), (d) and at least one of (b) or (c): a. a polyorganosiloxane resin, composed of M and Q units having at least 3 alkenyl groups per molecule, herein after called "SiVi" groups, b. a polyorganosiloxane compound having at least 2 Si-bonded hydrogen groups on the polysiloxane chain, hereinafter called "SiH" groups, c. a telechelic polyorganosiloxane compound having terminal Si-H groups, and d. a hydrosilylation catalyst for the reaction of SiH groups with SiVi groups, e. a liquid diluent in an amount of from 0% to maximum 40% by weight of composition said components reacting together by hydrosilylation at a temperature below 4O0C when they are brought into contact on a substrate and cure to form a continuous film on the substrate. Such formulation can cure quickly at room temperature and can provide good balance between adhesion and tack. |
申请公布号 |
WO2011003054(A3) |
申请公布日期 |
2011.02.24 |
申请号 |
WO2010US40878 |
申请日期 |
2010.07.02 |
申请人 |
DOW CORNING CORPORATION;DOW CORNING FRANCE SAS;GARAUD, JEAN-LUC;KERGOSIEN, GUILLAUME;THOMAS, XAVIER |
发明人 |
GARAUD, JEAN-LUC;KERGOSIEN, GUILLAUME;THOMAS, XAVIER |
分类号 |
C08L83/04;C08G77/12;C09D183/04 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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