发明名称 BALL MOUNTING APPARATUS, BALL MOUNTING METHOD, BALL-MOUNTED SUBSTRATE, AND ELECTRONIC COMPONENT-MOUNTED SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus or the like which mounts a ball on a mounting object without excess and shortage. <P>SOLUTION: The ball mounting apparatus includes a sucking head 2 for carrying out a sucking process of sucking a plurality of balls, and a supply portion 3 for carrying out a supply process of supplying the balls to the sucking head 2 in carrying out the sucking process, and is constituted to execute a mounting process of mounting the balls sucked by the sucking head 2 on a substrate 400. The ball mounting apparatus includes a detection portion 5 for carrying out a first detection process of detecting excess and shortage of the balls at the sucking head 2 after the sucking process is carried out, a first removing portion 6 for carrying out a first removal process of removing the balls sucked by the sucking head 2 from the sucking head 2, and a control portion 11 for controlling the sucking head 2, the supply portion 3, and the first removal portion 6. The control portion 11 re-executes the sucking process and supply process after the first removal process is carried out when excess of the balls is detected in the first detection process, and re-executes the sucking process and supply process when shortage of the balls is detected in the first detection process. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011040704(A) 申请公布日期 2011.02.24
申请号 JP20090293893 申请日期 2009.12.25
申请人 HIOKI EE CORP 发明人 SEKI KAZUHIKO
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
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