| 摘要 |
Light is modulated using an array of modulation elements formed on a semiconductor substrate, and control circuitry connected to the array for controlling each of the modulation elements independently, each of the modulation elements having a surface which is caused to exhibit a predetermined impedance characteristic to particular frequencies of light. Each modulation element has a deformable portion held under tensile stress, and the control circuitry controls the deformation of the deformable portion. The elements are made by forming a sandwich of two layers and a sacrificial layer between them, the sacrificial layer having a thickness related to the final cavity dimension, and using water or an oxygen based plasma to remove the sacrificial layer.
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