MULTI-CHIP MEMORY DEVICE WITH STACKED MEMORY CHIPS, METHOD OF STACKING MEMORY CHIPS, AND METHOD OF CONTROLLING OPERATION OF MULTI-CHIP PACKAGE MEMORY

摘要

A multi-chip memory device includes a transfer memory chip communicating input/output signals, a stacked plurality of memory chips each including a memory array having a designated bank, and a signal path extending upward from the transfer memory chip through the stack of memory chips to communicate input/output signals, wherein each bank of each memory chip in the stacked plurality of memory chips is commonly addressed to provide read data during a read operation and receive write data during a write operation, and vertically aligned within the stacked plurality of memory chips.