ELECTRONIC MODULE AND PACKAGING METHOD THEREOF

摘要

An electronic module and a packaging method thereof are provided. The electronic module includes: a substrate; at least one electronic element disposed on an upper surface of said substrate; a first conductive part (12) and a second conductive part (13) used for connecting said electronic module to an external PCB; the first conductive part (12) is disposed on a lower surface (112) of said substrate and connected to said electronic element; the second conductive part (13) is disposed on a side surface and lower surface (112) of the substrate. Since the second conductive part straddled on the side surface and lower surface of the substrate, it could increase the bonding quality when the electronic module bonds to the PCB.