OPTICAL SEMICONDUCTOR DEVICE

摘要

PURPOSE: A photonic semiconductor device is provided to improve the durability of reflection efficiency by the sealing of a semiconductor with a curable silicon resin composition. CONSTITUTION: A pre-mold package(2) on a cup is integrated with a lead frame. The electrode of a photonic semiconductor device(3) is connected to the lead frame through a conductive adhesive or conductive wire. The photonic semiconductor device is mounted in the pre-mold package. The pre-mold package is sealed with sealing resin(7). The lead frame is coated with silver plating. The surface of the silver plating has an average illumination of a central line below 0.3 um and the 10 point average illumination(Rz) below 2 um.