| 摘要 |
PURPOSE: An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent warpage property and soldering resistance required for a lead-free soldering process. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device comprises, based on 100 parts by weight of the epoxy resin composition, 3~14 parts by weight of epoxy resins represented by chemical formula 1; 2~12 parts by weight of hardeners represented by chemical formula 2; and 80~92 parts by weight of inorganic filler. In chemical formula 1, n and m are 0 or 1. In chemical formula 2, k is 1-7.
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