| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition capable of obtaining excellent strength even when cured at a low temperature and for a short time as well as fully maintaining characteristics such as adhesive strength and connection resistance even after a reliability test (an exposure test for a long period of time under high temperature and high humidity conditions), and to provide a connection structure of a circuit member using the adhesive composition. <P>SOLUTION: This adhesive composition includes a thermoplastic resin (a), a radically polymerizable compound (b), a dendritic compound (c) the branched part of which binds to a core part so as to make a dendritic branch and has a terminal part at its end, and a radical polymerization initiator (d). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
