| 摘要 |
PROBLEM TO BE SOLVED: To provide a dividing method of package substrate, the method economically dividing a warped package substrate. SOLUTION: The method includes: a mounting step of mounting a package substrate 2 on a fixture 20 including a holding surface for holding the package substrate 2; a holding step of operating a suction source to suck and hold the package substrate 2 by the fixture 20; and a division step of cutting and dividing the package substrate 2 held by the fixture 20 into individual packages with a cutting blade 40. The fixture includes: a plurality of recessed portions 56 formed on the holding surface to correspond to each package of the package substrate 2; a plurality of bellows suction pads 24 each disposed within each recessed portion 56 and having a suction portion protruding from the holding surface; suction paths 68 and 59 allowed to communicate with the suction source which gives suction effect to the suction pads 24; and a plurality of release grooves 22 formed on the holding surface to avoid the contact with the cutting blade 40, the holding surface being formed of at least rubber. COPYRIGHT: (C)2011,JPO&INPIT |
