| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which can be manufactured in a simple process inexpensively while preventing defect such as cracks of a chip-type component. SOLUTION: The electronic component E1 includes a laminated capacitor 1, a pair of lead terminals 20A, 20B, and a casing 100. The laminated capacitor 1 includes a pair of external electrodes 12A, 12B arranged on an outer surface of a dielectric body 10. The casing 100 includes a housing space V for housing the laminated capacitor 1, and an insertion hole 102A in which the lead terminal 20A is inserted. The laminated capacitor 1 positioned in the housing space V is sandwiched between third and fourth parts 20Ac, 20Ad of the lead terminal 20A and third and fourth parts 20Bc, 20Bd of the lead terminal 20B, and pawl portions 108A, 108B integrally formed on the casing 100. COPYRIGHT: (C)2011,JPO&INPIT
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