摘要 |
PROBLEM TO BE SOLVED: To provide a structure of a ceramic substrate that can be efficiently assembled in a circular can package being a standard article. SOLUTION: When the ceramic substrate is assembled in the circular can package being the standard article, the ceramic substrate is formed in a polygonal shape including a circle, an external diameter or a length of a diagonal of the ceramic substrate is made a little smaller than an internal diameter of a cap covering a component assembled in the circular can package, and a plurality holes are formed into which a plurality of pins fitted to the circular can package in advance can be inserted. COPYRIGHT: (C)2011,JPO&INPIT
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