发明名称 |
SOLID STATE DATA STORAGE ASSEMBLY |
摘要 |
<p>A solid state data storage assembly includes thermal interface material that conducts heat away from electrical components of the assembly. In some examples, the thermal interface material is positioned between a printed circuit board assembly, which includes electrical components, and a cover of a housing of the data storage assembly. The thermal interface material may also provide shock protection for the data storage assembly by at least one of increasing a stiffness of the data storage assembly, absorbing some mechanical loads applied to the data storage assembly or distributing the applied loads. In addition, in some examples, the thermal interface material exhibits some tackiness, such that removal of a thermal interface material from a data storage assembly and subsequent repositioning of the thermal interface material within the data storage assembly may provide a visual indication of tampering.</p> |
申请公布号 |
WO2011022083(A1) |
申请公布日期 |
2011.02.24 |
申请号 |
WO2010US25404 |
申请日期 |
2010.02.25 |
申请人 |
SEAGATE TECHNOLOGY LLC;JANIK, PETER;JOHNSTON, DARREN;HARWOOD, GORDON |
发明人 |
JANIK, PETER;JOHNSTON, DARREN;HARWOOD, GORDON |
分类号 |
H05K5/02;H05K7/20 |
主分类号 |
H05K5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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