SOLDER BUMP DELIVERY DEVICE

摘要

A solder bump delivery device comprises: a wafer chuck for supporting wafers formed with direct circuit elements having bump pads; a template chuck for supporting templates having surface cavities which correspond to the bump pads and are filled with solder materials, the template chuck being disposed such that the solder materials and the bump pads face each other; a flux coating unit which is disposed so as to be able to move between the wafer chuck and the template chuck in order to coat flux over the template; a heater which is connected to the template chuck and heats the flux-coated template in order to form the solder materials into solder bumps of spherical form; and a drive unit which provides relative vertical movement between the wafer chuck and the template chuck such that the solder bumps are delivered onto the bump pads.