| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device that is sealed with a sealing resin, and excellent in durability of reflection efficiency, especially, in a sulfur containing gas environment. <P>SOLUTION: In the optical semiconductor device constituted by connecting and mounting an electrode of an optical semiconductor element to a lead frame in a cup-shaped premolded package molded integrally with the lead frame through a conductive adhesive or conductive wires, and sealing the inside of the premolded package with the sealing resin, the lead frame is coated with silver plating having a surface of ≤0.3 μm in center-line average roughness (Ra) and ≤2 μm in 10-point average roughness (Rz). <P>COPYRIGHT: (C)2011,JPO&INPIT |
