发明名称 LIGHT-EMITTING ELEMENT-MOUNTING SUBSTRATE AND LIGHT-EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting element-mounting substrate capable of solving problems of short-circuit due to conduction to a metal substrate and distortion of the metal substrate due to local temperature rise while enhancing the heat radiation to the metal substrate; and to provide a light-emitting device including a light-emitting element mounted on the same. <P>SOLUTION: The light-emitting element-mounting substrate for mounting a light-emitting element 30 having at least one electrode 32 on the bottom includes: a metal substrate 10; an insulating layer 16 formed on the metal substrate 10; and a feeding pattern 20a formed on the insulating layer 16. The metal substrate 10 has a conduction region 10a continuing with the feeding pattern 20a and a non-conduction region 10b insulated from the conduction region 10a by removing at least the circumference of the conduction region 10a. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011040488(A) 申请公布日期 2011.02.24
申请号 JP20090184880 申请日期 2009.08.07
申请人 DENKA AGSP KK 发明人 YOSHIMURA EIJI
分类号 H01L33/48 主分类号 H01L33/48
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