发明名称 HIGHLY THERMAL CONDUCTIVE AND FORMABLE THERMOPLASTIC COMPOSITE MATERIAL AND COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a material for a composite material, having a particulate filler in a high ratio. <P>SOLUTION: The thermoplastic composition or composite material, which is thermally conductive and formable, may contain a plurality of filler particles coated with a metal, a plurality of secondary filler particles, and a polymer matrix in a mixture of the filler particles coated with the metal and the secondary filler particles. The composition and the composite material may have a thermal conductivity in the range of about 20 W to about 35 W/m×K. An injection molded article, having the composition or the composite material which has thermal conductivity and thermoplasticity and is formable, may be produced in order to apply to microelectronics, automobile, aviation electronics and other heat dissipation. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011038078(A) 申请公布日期 2011.02.24
申请号 JP20100123935 申请日期 2010.05.31
申请人 LAIRD TECHNOLOGIES INC 发明人 BUKKINAKERE KAPANIPATHAIYA CHANDRASEKHAR;RAMACHANDRAIAH MANJUNATHA HOSAHALLI;KUMAR BAMBORE LOKESHWARAPPA SANTHOSH;DURAISWAMY SRINIVASAN
分类号 C08L101/00;C08K3/04;C08K3/22;C08K3/28;C08K9/02 主分类号 C08L101/00
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