| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film with a copper foil which enables a multilayer printed wiring board where a copper layer having high adhesive strength for an insulating layer is formed to be obtained although surface roughness of the insulating layer formed on a circuit board is extremely small. SOLUTION: The copper foil having a copper alloy plating layer formed on a surface is stuck, by a specific method, on a curable resin composition layer formed on a base. COPYRIGHT: (C)2011,JPO&INPIT |
