| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve reduction of the size of and enhancement of the reliability, mounting strength, and mounting reliability of a semiconductor module. <P>SOLUTION: The semiconductor module 1 includes: a wiring substrate 2; an electronic component 3 placed over the upper surface 2a of the wiring substrate 2; an electronic component 4 placed over the under surface 2b of the wiring substrate 2; a lead 5 placed over the under surface 2b of the wiring substrate 2; and an encapsulation resin 6 covering the under surface 2b of the wiring substrate 2 including the electronic component 4 and the lead 5. The lead 5 includes: a first portion 21 coupled to an electrode pad 13b via a joining material 10; a second portion 22 bent from the first portion 21; and a third portion 23 bent from the second portion 22. The third portion 23 is positioned closer to the peripheral edge portion side of the under surface 2b of the wiring substrate 2 than the first portion 21. At the same time, the third portion is arranged at a position farther from the under surface 2b of the wiring substrate 2 than the first portion 21. The third portion 23 of the lead 5 is exposed from the main surface 6a and the side surface 6b of the encapsulation resin 6 and functions as a terminal for external coupling. <P>COPYRIGHT: (C)2011,JPO&INPIT |
