| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent occurrence of an appearance failure on a processed surface of a substrate to be processed even when the substrate to be processed is bonded on a supporting substrate which has an outer shape larger than that of the substrate to be processed with a photothermal conversion layer and an adhesive layer therebetween, and even when the surface, which is of the substrate to be processed and is opposite to the bonded surface, is processed. <P>SOLUTION: An adhesive layer 4 is formed on one surface of the substrate 3 to be processed, a photothermal conversion layer 2 is formed on one surface of a supporting substrate 1 having a surface which has an outer shape larger than that of the surface of the substrate 3, and a laminated body is obtained by bonding the substrate 3 on the surface of the photothermal conversion layer 2 with the adhesive layer 4 therebetween. The laminated body is placed on a spin chuck 9 in a chamber 8 of a spin coater apparatus, a portion 2a which is of the photothermal conversion layer 2 and is exposed from the substrate 3, is removed with an alkaline aqueous solution 11, and then, the exposed portion is cleaned by a high-pressure cleaning nozzle 12. Then, polishing, wet-processing and the like are performed to the surface of the substrate 3, and a semiconductor device is manufactured. <P>COPYRIGHT: (C)2011,JPO&INPIT |
