| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heatsink including an electromagnetic bandgap structure which reduces electromagnetic interference caused by an integrated circuit in an electronic device. <P>SOLUTION: The heatsink 10 includes a base 20 with an array 28 of electrically-conductive, thermally-conductive patches spaced apart in two dimensions X, Y of a reference plane 14 and having a thickness perpendicular to the reference plane. The patches are interconnected by a plurality of branches having a width narrower than a width of the respective adjacent patches. A plurality of thermally conductive cooling fins 42 are coupled to a surface of the base and extend vertically to the reference surface. The cooling fins may be formed of a thermally-conductive, electrically non-conductive material or may be coupled to the base by the thermally-conductive, electrically non-conductive material 26. The periodically patterned structure of the base, together with a solid metal layer of a circuit board, form the electromagnetic bandgap structure that reduces certain frequencies of electromagnetic noise caused by the integrated circuit. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
