| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which conduction between a wiring layer formed at least on one of a top surface and a reverse surface of a ceramic layer and a via conductor or through-hole conductor penetrating ceramic is stable and satisfactory, and to provide a method of manufacturing the wiring board that securely provides the wiring board through simple processes. SOLUTION: The wiring board includes the ceramic layer S having the top surface Sa and reverse surface Sb, wiring layers P1, P4 formed on the top surface Sa and reverse surface Sb of the ceramic layer, and the via conductors V penetrating the ceramic layer S and having ends (v) connected to the wiring layers P1, P4. The ends (v) of the via conductors V protrude outward (upward or downward) from surfaces of the wiring layers P1, P4, and connection surfaces F (f1) which are annular in plane view are provided between the via conductors V and the surfaces of the wiring layers P1, P4. COPYRIGHT: (C)2011,JPO&INPIT |
