| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of grinding a rigid wafer in which the rigid wafer does not crack even when ground to be processed thin. SOLUTION: The method of grinding the rigid wafer by a grinding device including a chuck table for holding the rigid wafer having a plurality of optical devices formed on a surface and a grinding means of grinding the rigid wafer held on the chuck table includes a wafer supporting step of closing an opening part of an annular frame having the opening part by sticking an adhesive tape on the annular frame while applying tension to the adhesive tape in a radial direction, and sticking a surface side of the rigid wafer on the adhesive tape to support the wafer with the annular frame, a wafer holding step of holding the wafer on the chuck table by bringing the adhesive tape side mounted on the annular frame into contact with a holding surface of the chuck table, and a grinding step of grinding an exposed surface of the wafer held on the chuck table. COPYRIGHT: (C)2011,JPO&INPIT |
