发明名称 COMPOSITE METAL-PARTICULATE MATERIAL, METAL FILM, METHOD FOR PRODUCING METAL FILM, PRINTED CIRCUIT BOARD AND ELECTRIC WIRE CABLE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a composite metal-particulate material which can be sintered in a sintering process of a lower temperature and of a shorter time than those in a conventional process, in other words, with high production efficiency, and also has properties that can develop sufficient electroconductivity by the sintering process; a metal film formed by sintering the same; a printed circuit board; an electric wire cable; and a method for producing the metal film. <P>SOLUTION: The composite metal-particulate material is prepared by mixing spherical silver (Ag) nanoparticles which have been synthesized by using a silver (Ag) compound, a solvent, a reducing agent and a dispersing agent, and an electroconductive filler formed of non-spherical metal particulates. The metal film is formed by sintering the composite metal-particulate material at such a low temperature as 300°C or lower and for such a short time as 10 min or shorter. The method for producing the metal film includes the step of sintering the composite metal-particulate material at such a low temperature as 300°C or lower and for such a short time as 10 min or shorter. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011038141(A) 申请公布日期 2011.02.24
申请号 JP20090185467 申请日期 2009.08.10
申请人 HITACHI CABLE LTD 发明人 ISHIKAWA MASARU;ABE TOMIYA;ITO MASANORI
分类号 B22F1/00;B22F7/04;B22F9/24;H01B5/00;H01B5/14;H01B7/00;H01B13/00;H05K3/12 主分类号 B22F1/00
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