| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor apparatus, capable of preventing a substrate from upheaval in a mold in a sealing process. SOLUTION: The method includes the steps of: preparing a lead frame 10 in which a plating layer 27 and grooves 31 and 32 that surround a product efficient region are provided in a void region on a back surface 12 side; mounting an IC element on a surface 11 of the lead frame 10; arranging the lead frame 10 to a lower mold 81 so that the back surface 12 of the lead frame 10 is opposed to a surface 82 on which grooves 97 and 98 of the lower mold 81 are formed, and so that the groove 31 is overlapped with one end of the grooves 97 and 98, and so that the lead frame 10 is not overlapped with the other end of the grooves 97 and 98; and sealing a plurality of terminals 21 and the IC element by injecting a mold resin into a cavity while an upper mold 83 is overlapped to the lower mold 81 so as to cover the lead frame 10, and that the cavity between the lower mold 81 and the upper mold 83 is depressurized. COPYRIGHT: (C)2011,JPO&INPIT
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