| 摘要 |
A piezoelectric component that has a superior level of molding pressure resistance while reducing the height and size thereof, is manufactured at low cost by using a photosensitive resin film to which is added a nano filler or a mica filler. The invention relates to a piezoelectric component and a manufacturing method of a piezoelectric component comprising: a piezoelectric substrate; a comb electrode formed on a main surface of the piezoelectric substrate; a piezoelectric device composed of wiring electrodes having device wiring sections disposed adjacent to the comb electrode; an insulation layer formed on an upper surface of the device wiring sections; a rewiring layer formed on an upper surface of the insulation layer; a protective film layer that is composed of an inorganic material and that covers the entire upper surface of the rewiring layer excluding the comb electrode; an outer periphery wall section formed by laminating a photosensitive resin film to which is added a nano filler onto the protective film layer; a ceiling section formed by laminating the photosensitive resin film to which is added a nano filler or a mica filler onto top openings of the outer periphery wall section; and electrode posts formed so as to pass through the outer periphery wall section and the ceiling section. Here the photosensitive resin film to which is added a nano filler is composed of a photosensitive resin to which is added an inorganic nano filler with a mean particle size of 1.0 nm or less, and has an elastic modulus of 3.0 GPa or greater.
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