发明名称 DETECTING METHOD, WAFER CARRYING-IN METHOD, AND DETECTING DEVICE
摘要 PROBLEM TO BE SOLVED: To speedily detect a position of a different-shape part formed at an outer peripheral end of a wafer. SOLUTION: A detecting method includes acquiring a position of the outer peripheral end within an imaging range of an imaging camera 93 as imaging data by imaging the imaging range during a stop of a rotary stage 911, mounted with the wafer whose outer peripheral edge formed of an arc part and the different-shape part, while rotating the rotary stage 911 intermittently at each predetermined angle, and also acquiring position change of the outer peripheral end passing through the imaging range of the imaging camera 93 during rotation of the rotary stage 911 as measurement data. Then positions on the arc part of the wafer are selected from the imaging data, and reference data is generated which represents position change within the imaging range when positioned on the entire circumference of the circle including the arc part are positioned within the imaging range for each angle of rotation of the rotary stage 911. Then the measurement data is compared with the reference data to detect the position of the different-shape part. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011040637(A) 申请公布日期 2011.02.24
申请号 JP20090187854 申请日期 2009.08.13
申请人 DISCO ABRASIVE SYST LTD 发明人 KUBO TETSUO;FUKUSHI NOBUYUKI
分类号 H01L21/68;G01B11/00;H01L21/304 主分类号 H01L21/68
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