发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technology for taking a resin seal body cured in a cavity of a molding metal mold out of the cavity without breaking it. SOLUTION: When the resin seal body 12c in the cavity of the molding metal mold is released from a lower mold 3, the resin seal body 12c is pushed up by a lower mold ejector pin 5a, for example, by 10 to 20% of the thickness thereof, and then a plunger 14 is elevated. Then, the resin seal body 12c in a cull is pushed up by the plunger 14 and the entire resin seal body 12c is thereby obliquely pushed up to be released from the tip of the lower mold ejector pin 5a. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011040625(A) 申请公布日期 2011.02.24
申请号 JP20090187662 申请日期 2009.08.13
申请人 RENESAS ELECTRONICS CORP 发明人 OKAWA OSAMU
分类号 H01L21/56;B29C45/02;B29C45/03;B29C45/14;B29C45/40;B29L31/34 主分类号 H01L21/56
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