发明名称 RELEASE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a release sheet which can form a through-hole in high dimensional accuracy and high positional accuracy in a resin sheet in which a through-hole is to be formed. SOLUTION: The release sheet is attached provisionally to the resin sheet in which the through-hole is to be formed, used to form the through-hole in the resin sheet in which the through-hole is to be formed, and has a base material film, a first resin layer which is formed on a surface of the base material film opposite to the surface which is attached provisionally to the resin sheet in which the through-hole is to be formed and composed mainly of a resin material, and a second resin layer which is formed on a side of the base material film which is attached provisionally to the resin sheet in which the through-hole is to be formed and composed mainly of a resin material. The softening temperature (A) measured by a thermomechanical analysis (measurement condition: in nitrogen; the temperature rising speed 5°C/min) of the base material film is at least 180°C, and the 10% mass reduction temperature (B) measured by a thermogravimetric analysis (measurement condition: in nitrogen; the temperature rising speed 5°C/min) of the first resin layer is 180-280°C. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011037036(A) 申请公布日期 2011.02.24
申请号 JP20090183879 申请日期 2009.08.06
申请人 LINTEC CORP 发明人 TAKAHASHI AKIRA;ETO HIROYUKI;YAMADA AKIYA;OKUDA TAKUYA
分类号 B32B27/00;B32B27/08 主分类号 B32B27/00
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