发明名称 TRANSPARENT RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a transparent resin composition in which an inorganic filler having a small particle diameter is sufficiently dispersed and which has high transparency and excellent heat resistance, dimensional stability and the like and a method for producing the same and to provide an optical semiconductor device sealed by a cured product of the composition. SOLUTION: A pre-mixture (A) formed by premixing the inorganic filler having 5 to 40 nm average primary particle diameter and an epoxy resin, a pre-mixture (B) formed by premixing the inorganic filler having 5 to 40 nm average primary particle diameter and an acid anhydride curing agent and a curing promoter (C) are mixed to form the transparent resin composition. The optical semiconductor element is sealed by the cured product of the transparent resin composition. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011037996(A) 申请公布日期 2011.02.24
申请号 JP20090187088 申请日期 2009.08.12
申请人 KYOCERA CHEMICAL CORP 发明人 TAKAHASHI YUKO;SUZUKI SAEKO
分类号 C08L63/00;C08G59/42;C08J3/20;C08K3/00;H01L23/29;H01L23/31 主分类号 C08L63/00
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